|
|
|
|
|
|
|
|
 |
Vacuum deposition machines and processes for: |
|
|
|
|
|
|
Vacuum machines and processes for: |
|
|
|
|
|
|
Components |
|
|
|
|
|
|
Special equipment |
|
|
|
|
|
|
|
|
Sidrabe, Inc.
Riga, Latvia LV-1073
Tel: +371 67249806
Fax: +371 67139506
E-mail: sidrabe@sidrabe.eu |
|
|
| Special equipment/Drying machines |
|
|
Vacuum Laminators play a critical role in the production of Flexible Printed Circuits based on polyimide film.
Vacuum Laminators Z2P340 and Z2P355 have been designed for two-side lamination of Flexible Printed Circuits on the basis of polyimide film with photo resist polymer material. The preheated FPC film passes between two heated pressure rollers together with the photo resist.
Corresponding temperature and pressure are applied to ensure good contact of the surfaces. The double-sided laminated material is transported to chilled rollers and then to rewinding. The machine winding system provides interleaf unwinding from two photo resist rolls and from the initial PI roll as well as rewinding of the ready-made product together with the interleaf.
The process is automatically controlled by the control system. The major process parameters are monitored during the cycle: temperature, pressing force, winding speed, tension of the materials, edge position, pressure in the chamber and pumping system.
|
|
|
|
|
|
|
|
|
|
 |
 |
 |
| Vacuum laminator Z2P340 |
Vacuum laminator Z2P355 |
Laminator winding system |
|
Technical Specifications
Substrate: Flexible Printed Circuit on polyimide film
Substrate width: up to 355 mm (or more at Customer’s request)
Film thickness range: 25 - 180 micron
Maximum roll diameter: 280 mm
Substrate preheating temperature: 80 - 115 °C
Laminating material: photo resist
Range of photo resist thickness: 25-50 micron
Lamination temperature: 35 - 120 °C
Winding speed: 0.3 - 3.5 m/min
Pressure in the chamber: 0.05 - 10 Torr
Overall dimensions: 4.8 x 4.4 x 2.4 m |
|
|
|
|
